POS Warfare: Difference between revisions

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As a general rule of thumb, "array" structures are mounted inside the POS bubble while "battery" structures are mounted outside the POS bubble. If the module targets enemy ships then it must be outside the POS bubble. This is enforced by the game when you attempt to anchor the structure at the POS location. Batteries should be evenly spaced around the POS bubble in order to avoid dead spots or weaknesses in coverage. See the section on [[POS Warfare#Offense|offense]] for more discussion on this.

===Shield Hardening ~~Arrays~~===

===Shield Hardening===

* 4000 m3 4000 kg

* 150,000 PG 250 CPU

* 20k shield HP, 20k armor HP, 20k structure HP

Shield hardeners come in four types, one for each resist, and should be mounted inside the POS bubble. They are named Ballistic Deflection Array (KIN), Explosion Dampening Array (EXP), Heat Dissipation Array (THE), and Photon Scattering Array (EMP). Shield hardening arrays are placed '''inside''' the POS bubble and cannot be targeted until the tower is destroyed.

[[File:POSShieldResists1.jpg]]

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A tower with high resists becomes very difficult to reinforce since you force the attackers to spend 1.8x to 3.1x more time then if you don't plug the two 0% resist holes. Trying to stack the resist modules beyond 4/4/3/2 is pointless (due to stacking penalties) and you'd be better off using that PG/CPU for other defensive modules.

See [[POS Structures#Shield Hardening Arrays|Shield Hardening Arrays]] on the [[POS Structures]] page for more detailed information.

===Sensor Dampening Battery===

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 As a general rule of thumb, "array" structures are mounted inside the POS bubble while "battery" structures are mounted outside the POS bubble.  If the module targets enemy ships then it must be outside the POS bubble.  This is enforced by the game when you attempt to anchor the structure at the POS location.  Batteries should be evenly spaced around the POS bubble in order to avoid dead spots or weaknesses in coverage.  See the section on [[POS Warfare#Offense|offense]] for more discussion on this.
-===Shield Hardening Arrays===
+===Shield Hardening===
-* 4000 m3 4000 kg
-* 150,000 PG 250 CPU
-* 20k shield HP, 20k armor HP, 20k structure HP
-Shield hardeners come in four types, one for each resist, and should be mounted inside the POS bubble.  They are named Ballistic Deflection Array (KIN), Explosion Dampening Array (EXP), Heat Dissipation Array (THE), and Photon Scattering Array (EMP).  Shield hardening arrays are placed '''inside''' the POS bubble and cannot be targeted until the tower is destroyed.
 [[File:POSShieldResists1.jpg]]
@@ Line 47: / Line 42: @@
 A tower with high resists becomes very difficult to reinforce since you force the attackers to spend 1.8x to 3.1x more time then if you don't plug the two 0% resist holes.  Trying to stack the resist modules beyond 4/4/3/2 is pointless (due to stacking penalties) and you'd be better off using that PG/CPU for other defensive modules.
+See [[POS Structures#Shield Hardening Arrays|Shield Hardening Arrays]] on the [[POS Structures]] page for more detailed information.
 ===Sensor Dampening Battery===